HTC signs with 5G partners across the globe
Over the past two weeks, carriers across the globe announced they have signed up with HTC to deliver upcoming 5G products.
Sprint and Telstra will both carry a 5G mobile smart hub built by HTC, one of the first devices of its kind to work across 5G networks.
This device will supposedly serve as a dedicated 5G mobile hotspot, smart device, and more, and will debut in 2019.
HTC CEO Cher Wang says, "HTC is leading the innovation wave for mobile technologies with 5G.
"Today, consumers count on their smartphones, and the carriers that power them, for everyday use at home and at work, but we believe that 5G technology will help connect solutions across even more applications in the future, creating a seamless experience across smartphones, VR, AR, and more."
HTC developed the new 5G hub to take advantage of blazing-fast 5G speeds and connectivity in an innovative and portable design for the home, on the go and enterprise use.
Qualcomm's Snapdragon 855+SDX 50 chipset powers this device that supposedly offers portability, high performance, low latency, and high bandwidth.
The product will allow customers to use 5G on multiple devices while on the go, at work, or at home for fast connectivity, content sharing, entertainment and more.
A built-in gigabit Ethernet port offers network compatibility and a large touchscreen allows for ease of use and advanced visuals.
With mobile 5G at its core, HTC is readying itself for a future of go-anywhere, high-bandwidth multimedia and connected data services.
As a stakeholder in smart mobile devices and technology, HTC has produced products and industry firsts since its inception in 1997, including the HTC U and Desire lines of smartphones.
Future partners in other regions, including Europe, will be announced next year.
More specifics about the device, including feature specifications and timing, will also be shared at a later date.
As it stands HPC seems to be one of many companies aiming to capitalise on the growing hype surrounding 5G in 2019.
