Siemens launches Calibre 3DThermal for advanced thermal analysis

Siemens Digital Industries Software has launched Calibre 3DThermal, an innovative software solution for thermal analysis, verification, and debugging in 3D integrated circuits (3D-ICs). This software aims to address critical design and verification challenges involving heat dissipation in 3D-IC architectures.

Calibre 3DThermal integrates with Siemens’ advanced design tools to offer a comprehensive platform for capturing and analysing thermal data throughout the design process. The software leverages elements of Siemens' Calibre verification software, Calibre 3DSTACK software, and the Simcenter Flotherm software solver engine. This combination allows chip designers to model, visualise, and mitigate thermal effects from early-stage chip and assembly exploration through to design signoff.

Michael Buehler-Garcia, Vice President of Calibre Product Management at Siemens Digital Industries Software, said, “Calibre 3DThermal represents a significant advancement in 3D-IC design and verification, providing designers with the capabilities they need to address thermal challenges early in the design process. By integrating thermal analysis directly into all stages of the IC design flow, we’re enabling our customers to create more reliable, high-performance 3DICs with greater confidence and efficiency.”

The software offers a progressive approach to thermal analysis, starting with minimal inputs for initial feasibility studies and allowing for more detailed analysis as information becomes available. This iterative process, which includes refining floorplanning and adding stacked vias or TSVs (Through-Silicon Vias) to avoid thermal hotspots, continues until the final assembly is complete. The flexibility of this approach helps designers reduce the risk of performance, reliability, and manufacturing issues at the final tape-out.

Buehler-Garcia said, “Delivering thermal analysis at this advanced level requires a complete understanding of the 3D-IC assembly. Waiting until the assembly is complete to identify and correct errors can severely disrupt design schedules, but Calibre 3DThermal mitigates this risk through automation and integration, allowing designers to iterate thermal analysis at any design stage.”

The newly introduced software embeds a custom version of Siemens’ trusted Simcenter Flotherm software solver engine, enabling precise chiplet-level thermal models for static and dynamic simulation of full 3D-IC assemblies. Debugging is streamlined via the traditional Calibre RVE software results viewer, which is integrated across various IC design tools. Integrating these features results in an efficient thermal analysis solution tailored to the specific needs of 3D-IC designers.

In addition to being compatible with Siemens' in-house design tools, Calibre 3DThermal integrates with industry-expert third-party design tools. This integration ensures that thermal data is captured and analysed across the entire design lifecycle, enhancing the reliability and performance of 3D-ICs.

As part of a collaborative effort, Siemens has also partnered with United Microelectronics Corporation (UMC) to deploy an innovative thermal analysis flow powered by Calibre 3DThermal, specifically tailored for UMC’s wafer-on-wafer and 3D-IC technologies. This collaboration aims to provide UMC’s global clientele with a comprehensive thermal analysis capability to address critical thermal concerns and optimise their designs.

Osbert Cheng, Vice President of Device Technology Development & Design Support at UMC, said, “As the semiconductor industry grapples with escalating thermal challenges, particularly in the realm of heat dissipation and thermal gradients within advanced 3D-IC technologies, UMC remains committed to providing effective solutions."

“Through our collaboration with Siemens and the implementation of Calibre 3DThermal, we will be able to offer our customers a comprehensive thermal analysis capability, enabling them to address critical thermal concerns and optimise their designs for enhanced performance and reliability.”